Rapid development of electronic devices, power systems and communication equipments present an increasing requirement for the heat dissipation. Hexagonal boron nitride (h-BN) is very useful as an insulating and thermal conductive filler, and more and more attentions have been paid to its thermal conductive composites. In this article, we focus on the detail progress of h-BN-based thermal conductive composites, including thermal transfer mechanism and present situation. Furthermore, some current technical defects and difficulties are summarized, and the future developing trend of h-BN-based thermal conductive composites is also prospected.